Rongo Univesity Library catalog › Details for: Advanced manufacturing process, lead free interconnect materials and reliability modeling for electronics packaging

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Advanced manufacturing process, lead free interconnect materials and reliability modeling for electronics packaging

Additional authors: Bailey, Christopher. | Liu, Johan. | ebrary, Inc.

Series: Soldering & surface mount technology ; . v.18, no. 2 Published by : Emerald Group Publishing, (Bradford, England :) Physical details: 72 p.

Subject(s): Manufacturing processes. | Electronic packaging. | Electronic books.

Year: 2006

Online resources:

http://site.ebrary.com/lib/rucke/Doc?id=10132649
- An electronic book accessible through the World Wide Web; click to view

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Electronic reproduction. Palo Alto, Calif. : ebrary, 2009. Available via World Wide Web. Access may be limited to ebrary affiliated libraries.

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