01361nam a2200325 a 4500001001200000003000800012006001900020007001500039008004100054020001800095020002700113040002100140035002100161050002700182245012200209260004300331300003000374504005100404505004800455533015200503650005400655650002600709650006100735655002900796700001700825700002600842700002400868710001700892856012600909ebr10529302CaPaEBRm        u        cr cn|||||||||120218s2012    gw a    sbf   001 0 eng d  z9783527326464  z9783527644247 (e-book)  aCaPaEBRcCaPaEBR  a(OCoLC)77961637314aTK7871.85b.H36 2012eb00aHandbook of wafer bondingh[electronic resource] /cedited by Peter Ramm, James Jian-Qiang Lu, and Maaike M.V. Taklo.  aWeinheim, Germany :bWiley-VCH,c2012.  axxxi, 395 p. :bcol. ill.  aIncludes bibliographical references and index.0 apt. 1. Technologies -- pt. 2. Applications.  aElectronic reproduction.bPalo Alto, Calif. :cebrary,d2011.nAvailable via World Wide Web.nAccess may be limited to ebrary affiliated libraries. 0aSemiconductorsxBondingvHandbooks, manuals, etc. 0aSemiconductor wafers. 0aMicroelectromechanical systemsxDesign and construction. 7aElectronic books.2local1 aRamm, Peter.1 aLu, James Jian-Qiang.1 aTaklo, Maaike M. V.2 aebrary, Inc.40uhttp://site.ebrary.com/lib/rucke/Doc?id=10529302zAn electronic book accessible through the World Wide Web; click to view