01904nam a2200373 a 4500 ebr10494525 CaPaEBR m u cr cn||||||||| 110509s2011 njuad sb 001 0 eng d 2011019534 9780470827802 (hardback) 9780470827826 (oBook) 9780470828410 (ePub) 9781118082829 (Mobi) 9780470827819 (e-book) CaPaEBR CaPaEBR (OCoLC)756280855 TK7870.15 .L58 2011eb 621.381/046 23 Liu, S. (Sheng), 1963- Modeling and simulation for microelectronic packaging assembly [electronic resource] : manufacturing, reliability and testing / Sheng Liu, Yong Liu. Hoboken, N.J. : Wiley, 2011. xxii, 564 p. : ill. Includes bibliographical references and index. pt. 1. Mechanics and modeling -- pt. 2. Modeling in microelectronic packaging and assembly -- pt. 3. Modeling in microelectronic package reliability and test -- pt. 4. Modern modeling and simulation methodologies : application to nano packaging. "This book is primarily concerned with studies of electronic packaging in assembly manufacture processes and failure mechanisms in assembly manufacture processes and tests through modeling and simulation"-- Provided by publisher. Electronic reproduction. Palo Alto, Calif. : ebrary, 2011. Available via World Wide Web. Access may be limited to ebrary affiliated libraries. Microelectronic packaging Simulation methods. Electronic books. local Liu, Yong, 1962- ebrary, Inc. http://site.ebrary.com/lib/rucke/Doc?id=10494525 An electronic book accessible through the World Wide Web; click to view 232278 232278