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Results of search for 'ccl=su:Microelectronic packaging and su:Simulation methods.'
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Liu, S.
Liu, Yong
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Microelectronic pack...
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1.
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Modeling and simulation for microelectronic packaging assembly
manufacturing, reliability and testing /
by
Liu, S.
Publication:
Hoboken, N.J. : Wiley, 2011 . xxii, 564 p. :
Date:
2011
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2.
No cover image available
Modeling and simulation for microelectronic packaging assembly
manufacturing, reliability and testing /
by
Liu, S.
Publication:
Hoboken, N.J. : Wiley, 2011 . xxii, 564 p. :
Date:
2011
Availability:
No items available:
Add to cart
(remove)
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