Rongo Univesity Library catalog › Results of search for 'ccl=su:Microelectronic packaging'

Your search returned 8 results.

	1.	Adhesion in microelectronics / Publication: . 1 online resource (367 pages) : Availability: No items available: Add to cart (remove)
	2.	No cover image available Lead-free solder interconnect reliability Publication: Materials Park, OH : ASM International, 2005 . x, 292 p. : Date: 2005 Availability: No items available: Add to cart (remove)
	3.	Adhesion in microelectronics / Publication: . 1 online resource (367 pages) : Availability: No items available: Add to cart (remove)
	4.	Components, packaging and manufacturing technology II : selected, peer reviewed papers from the 2013 3rd International Conference on Packaging and Manufacturing Technology (ICCPMT 2013), December 31, 2013 - January 2, 2014, Brisbane Australia / Publication: . 1 online resource (245 pages) : Availability: No items available: Add to cart (remove)
	5.	No cover image available Modeling and simulation for microelectronic packaging assembly manufacturing, reliability and testing / by Liu, S. Publication: Hoboken, N.J. : Wiley, 2011 . xxii, 564 p. : Date: 2011 Availability: No items available: Add to cart (remove)
	6.	No cover image available Lead-free solder interconnect reliability Publication: Materials Park, OH : ASM International, 2005 . x, 292 p. : Date: 2005 Availability: No items available: Add to cart (remove)
	7.	No cover image available Lead-free solder interconnect reliability Publication: Materials Park, OH : ASM International, 2005 . x, 292 p. : Date: 2005 Availability: No items available: Add to cart (remove)
	8.	No cover image available Modeling and simulation for microelectronic packaging assembly manufacturing, reliability and testing / by Liu, S. Publication: Hoboken, N.J. : Wiley, 2011 . xxii, 564 p. : Date: 2011 Availability: No items available: Add to cart (remove)

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