Handbook of wafer bonding (Record no. 146345)
| 000 -LEADER | |
|---|---|
| fixed length control field | 01392nam a2200337 a 4500 |
| 245 00 - TITLE STATEMENT | |
| Title | Handbook of wafer bonding |
| 260 ## - PUBLICATION, DISTRIBUTION, ETC. (IMPRINT) | |
| Place of publication | Weinheim, Germany : |
| Name of publisher | Wiley-VCH, |
| Year of publication | 2012. |
| 300 ## - PHYSICAL DESCRIPTION | |
| Number of Pages | xxxi, 395 p. : |
| Other physical details | col. ill. |
| 505 0# - FORMATTED CONTENTS NOTE | |
| Formatted contents note | pt. 1. Technologies -- pt. 2. Applications. |
| 650 #0 - SUBJECT ADDED ENTRY--TOPICAL TERM | |
| Topical Term | Semiconductors |
| Topical Term | Semiconductor wafers. |
| Topical Term | Microelectromechanical systems |
| 700 1# - ADDED ENTRY--PERSONAL NAME | |
| Personal name | Ramm, Peter. |
| Personal name | Lu, James Jian-Qiang. |
| Personal name | Taklo, Maaike M. V. |
| 856 40 - ELECTRONIC LOCATION AND ACCESS | |
| Uniform Resource Identifier | http://site.ebrary.com/lib/rucke/Doc?id=10529302 |
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