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Handbook of wafer bonding

Additional authors: Ramm, Peter. | Lu, James Jian-Qiang. | Taklo, Maaike M. V. | ebrary, Inc.
Published by : Wiley-VCH, (Weinheim, Germany :) Physical details: xxxi, 395 p. : col. ill.
Subject(s): Semiconductors -- Bonding -- Handbooks, manuals, etc. | Semiconductor wafers. | Microelectromechanical systems -- Design and construction. | Electronic books.
Year: 2012
Online resources:
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Includes bibliographical references and index.

pt. 1. Technologies -- pt. 2. Applications.

Electronic reproduction. Palo Alto, Calif. : ebrary, 2011. Available via World Wide Web. Access may be limited to ebrary affiliated libraries.

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