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Results of search for 'ccl=su:Electronic packaging.'

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	1.	No cover image available Materials for high-density electronic packaging and interconnection report of the Committee on Materials for High-Density Electronic Packaging, National Materials Advisory Board, Commission on Engineering and Technical Systems, National Research Council. Publication: Washington, D.C. : \| Alexandria, VA : National Academy Press ; \| Available from Defense Technical Information Center, Cameron Station, 1990 . xiv, 139 p. : , "NMAB-449." Date: 1990 Availability: No items available: Add to cart (remove)
	2.	No cover image available Boundary-scan interconnect diagnosis by Sousa, Jos�e T. de. Publication: Boston : Kluwer Academic Publishers, 2001 . xxi, 168 p. : Date: 2001 Availability: No items available: Add to cart (remove)
	3.	No cover image available Advanced wirebond interconnection technology by Prasad, Shankara K. Publication: Boston : Kluwer Academic Publishers, 2004 . xxviii, 668 p. : Date: 2004 Availability: No items available: Add to cart (remove)
	4.	No cover image available Advanced wirebond interconnection technology by Prasad, Shankara K. Publication: Boston : Kluwer Academic Publishers, 2004 . xxviii, 668 p. : Date: 2004 Availability: No items available: Add to cart (remove)
	5.	No cover image available Advanced manufacturing process, lead free interconnect materials and reliability modeling for electronics packaging Publication: Bradford, England : Emerald Group Publishing, 2006 . 72 p. Date: 2006 Availability: No items available: Add to cart (remove)
	6.	Components, packaging and manufacturing technology II : selected, peer reviewed papers from the 2013 3rd International Conference on Packaging and Manufacturing Technology (ICCPMT 2013), December 31, 2013 - January 2, 2014, Brisbane Australia / Publication: . 1 online resource (245 pages) : Availability: No items available: Add to cart (remove)
	7.	No cover image available LED packaging for lighting applications design, manufacturing, and testing / by Liu, S. Publication: Hoboken, N.J. : Wiley, 2011 . x, 352 p. : Date: 2011 Availability: No items available: Add to cart (remove)
	8.	No cover image available Materials for high-density electronic packaging and interconnection report of the Committee on Materials for High-Density Electronic Packaging, National Materials Advisory Board, Commission on Engineering and Technical Systems, National Research Council. Publication: Washington, D.C. : \| Alexandria, VA : National Academy Press ; \| Available from Defense Technical Information Center, Cameron Station, 1990 . xiv, 139 p. : , "NMAB-449." Date: 1990 Availability: No items available: Add to cart (remove)
	9.	No cover image available Boundary-scan interconnect diagnosis by Sousa, Jos�e T. de. Publication: Boston : Kluwer Academic Publishers, 2001 . xxi, 168 p. : Date: 2001 Availability: No items available: Add to cart (remove)
	10.	No cover image available Advanced manufacturing process, lead free interconnect materials and reliability modeling for electronics packaging Publication: Bradford, England : Emerald Group Publishing, 2006 . 72 p. Date: 2006 Availability: No items available: Add to cart (remove)
	11.	No cover image available LED packaging for lighting applications design, manufacturing, and testing / by Liu, S. Publication: Hoboken, N.J. : Wiley, 2011 . x, 352 p. : Date: 2011 Availability: No items available: Add to cart (remove)

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